Optical storage media with embedded security device

ABSTRACT

An optical disk with an embedded security device, or wafer, is presented. The security device includes security features that enable the identification of genuine optical disks versus counterfeit optical disks. Methods for creating optical disks embedded with security devices are also presented. A security device is placed on the center pin of an open mold before the optical disk is formed. Alternatively, an optical disk having a cavity formed on a surface to receive a security device is created. A special mold with a raised platform creates the cavity on the optical disk. As a further alternative, two optical platters, each having a complementary cavity to accommodate a security device are created using a special mold having a raised platform. The security device is inserted into the complementary cavities and the optical platters and security device are bonded together.

FIELD OF THE INVENTION

The present invention relates to optical storage media and, inparticular, to optical storage media embedded with security devices.

BACKGROUND OF THE INVENTION

Counterfeiting is a problem for content providers. In the past,especially when using analog devices, counterfeits were typicallyinferior in quality to an authentic, or genuine, product. However, duein part to the advent of digital storage, counterfeits are now equal to,or nearly equal to, the authentic, or original, product in quality.Further compounding the problem for content providers is that opticalmedia, upon which most digital content is delivered, is now relativelyeasy and inexpensive to duplicate. Additionally, many illicitcounterfeiting operations generate counterfeited products that areincreasingly difficult to distinguish from the genuine products.

As part of their anti-counterfeiting efforts, content providers havefocused considerable effort at identifying counterfeited products. Someof these efforts include adding identification labels (that aredifficult and costly to duplicate) to the packaging and, more recently,creating holograms on the reflective coating applied to the opticalmedia. The ability to identify counterfeits is important to contentproviders as a large amount of counterfeits come through customs fromareas of the world where counterfeiting is inexpensive, and perhaps evenencouraged. Thus, if the content providers can identify the counterfeitsas they pass through customs, such counterfeits can be confiscatedand/or destroyed. As an added benefit to the identification efforts, thecost of creating counterfeits is increased. Theoretically, if theoverall cost to counterfeit a genuine article were raised to a levelwhere there was no profit in selling a counterfeit, no counterfeitswould be produced.

Many areas of an optical disk are generally unused. For example, the hubarea of an optical disk, i.e., the interior area of an optical disksurrounding the optical disk's center hole, is almost universallyunused. With the exception of some printed artwork in this area, it isgenerally an area that is not utilized. No optically stored data islocated within the hub area. Part of the reason that this area is unusedis because this is the area that an optical disk drive uses to secureand rotate the disk while reading and/or writing.

SUMMARY OF THE INVENTION

A counterfeit-resistant optical disk is presented. The optical disk hasa data area that stores optical data, and a non-data area that does notstore optical data. A security device is embedded into the non-data areaof the optical disk.

Methods for creating a counterfeit-resistant optical disk are alsopresented. According to one embodiment, a security device is positionedinto an optical disk mold. The mold is closed, and an optical disk isformed in the closed mold, thereby embedding the security device in theoptical disk. According to another embodiment, an optical disk, having acavity formed on a surface of the disk is obtained. A security device isplaced into the cavity and bonded to the optical disk. According to yetanother embodiment, first and second optical platters are obtained. Asecurity device is positioned between the first and second opticalplatters, and the optical platters are bonded together with the securitydevice between them.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of thisinvention will become more readily appreciated as the same become betterunderstood by reference to the following detailed description, whentaken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a pictorial diagram illustrating an exemplary optical diskhaving an embedded security wafer in the hub area of the disk, inaccordance with the present invention;

FIG. 2 is a pictorial diagram illustrating a cross-section of an opticaldisk embedded with a security wafer, where the security wafer isembedded in the optical disk such that the top of the security wafer isflush with a surface of the optical disk;

FIG. 3 is a pictorial diagram illustrating one exemplary manner ofcreating the optical disk embedded with a security wafer as shown inFIG. 2, using a specially molded optical disk;

FIG. 4 is a pictorial diagram illustrating an optical disk having asecurity wafer embedded entirely within the optical disk substrate;

FIG. 5 is a pictorial diagram illustrating a cross-section of an opticaldisk having a security wafer embedded entirely within the optical disksubstrate, as described above in regard to FIG. 4;

FIG. 6 is a pictorial diagram illustrating a security wafer with aspacing device on one side of the security wafer used to further embedthe security wafer into the optical disk;

FIG. 7 is a pictorial diagram illustrating a cross-section of an opticaldisk embedded with a security wafer having a spacing device, and formedin the manner described in FIG. 4;

FIG. 8 is a pictorial diagram illustrating another exemplary manner ofcreating an optical disk embedded with a security wafer using twospecially molded optical platters which, when combined with a securitywafer, form a single optical disk;

FIGS. 9A–9C are pictorial diagrams illustrating cross-sections of anoptical disk embedded with a security wafer formed from bonding twooptical platters;

FIG. 10 is a pictorial diagram illustrating an exemplary mold speciallyformed for creating specially molded optical platters as described inregard to FIGS. 2 and 8;

FIGS. 11A and 11B are pictorial diagrams illustrating cross-sections ofan exemplary mold for creating optical disks, and having a securitywafer placed on the center pin of the mold;

FIG. 12 is a flow diagram illustrating an exemplary process for creatingan optical disk embedded with a security wafer using a typical opticaldisk mold, such as those illustrated in FIGS. 11A and 11B;

FIG. 13 is a flow diagram illustrating an exemplary routine for creatingan optical disk embedded with a security wafer using specially formedoptical disks, such as those described in regard to FIG. 3; and

FIG. 14 is a flow diagram illustrating an exemplary routine for creatingan optical disk embedded with a security wafer using specially formedoptical platters, such as those described in regard to FIG. 8.

DETAILED DESCRIPTION

For purposes of this discussion, an optical disk refers to any of theCompact Disk (CD) family of optical disks, including, but not limitedto, CD-ROM, CD-R, and the like, as well as the Digital Video Disk (DVD)family of optical disks, including, but not limited to, DVD-ROM, DVD-R,and the like. Those skilled in the art will appreciate that otherstorage media, including other optical storage media and non-opticalstorage media, may realize similar benefits in applying the presentinvention. Additionally, as mentioned above, for purposes of thisdiscussion, the hub area of an optical disk refers to the interior areaof an optical disk surrounding the center hole. For example, in regardto a CD or DVD disk, the hub area is a concentric ring on the disk,having an inside diameter of 15.08 mm and an outside diameter of 34 mm,in accordance with the American National Standards Institute (ANSI) andthe International Organization for Standardization (ISO) specifications.

FIG. 1 is a pictorial diagram illustrating an exemplary optical disk 102having an embedded security wafer 104 in the hub area of the opticaldisk, in accordance with the present invention. As illustrated in FIG.1, the security wafer 104 is embedded into the optical disk 102, andoccupies the entire hub area of the disk. However, it should be notedthat, while FIG. 1 illustrates that the security wafer 104 occupies theentire hub area, it is for illustration purposes only, and should not beconstrued as limiting upon the present invention. While the dimensionsshown illustrate the maximum area for a security wafer 104, otherdimensions for a security wafer may be used. Additionally, whileembedding a security wafer 104 into the hub area of an optical disk maybe a preferred embodiment of the present invention, other non-databearing areas may also be utilized. For example, many optical disks aresingle-sided disks; thus, one side of the disk is a non-data bearingarea. The outside edge of an optical disk is also typically a non-databearing area. Both of these areas, as well as others, may be utilized,or in other words, embedded with a security wafer.

While the security wafer 104 is illustrated in FIG. 1, and in otherfigures, as a circular disk, it is also for illustrative purposes, andshould not be construed as limiting upon the present invention. While acircular security wafer, such as the security wafer 104 shown in FIG. 1,makes optimal use of the hub area, other geometric shapes may used.These other geometric shapes may prove beneficial foranti-counterfeiting purposes, such as providing easily identifiablepatterns, as well as proving more difficult to duplicate. It should benoted that the security wafer 104 should be embedded in the optical disksuch that it has only minimal effects upon the balance and/or rotationaldynamics of the optical disk. To achieve this minimal impact, in oneembodiment the security wafer 104 is concentrically located on theoptical disk.

Additionally, it should be further noted that while the followingdescriptions describe using a security wafer 104, it is illustrativeonly, and should not be construed as limiting upon the presentinvention. Other security devices that are not wafers may be used. Forexample, instead of a security wafer 104, a cylinder, bearing similarsecurity features as the security wafer, may be used. Other shapes andforms may also be used, and are contemplated as falling within the scopeof the present invention.

In accordance with aspects of the present invention, the security wafer104 may include any number of security, or anti-counterfeiting,features. Examples of these security features placed on a security wafer104 may include: encrypted, printed serial numbers; digital fingerprintsor watermarks; holograms; polarized filters, photo-luminescent coatings(detectable by specially tuned lasers); microscopic taggants, i.e.,microscopic markers not found in the base material but added to the basematerial to indicate the object's origin or authenticity; andradio-frequency identification (RFID) devices, to name just a few.Multiple features may be combined on a single security wafer 104.Additionally, any or all of the various security features may becombined in such a way as to uniquely identify each authentic opticaldisk 102, the content written onto the optical disk, or both.

While many materials may be suitable for use as a security wafer 104,such materials should not significantly increase the weight of theoptical disk 102, such that the optical disk's mass falls outside ofspecified standards. Additionally, the security wafer 104 should beconstructed and placed on the optical disk 102 so as to not cause animbalance to occur when the disk is rotated. According to oneembodiment, the base material of the security wafer is comprised of thesame base material as that of the optical disk 102. For example, most CDand DVD disks are made of a base polycarbonate material. Thus, in oneembodiment, the base material for the security wafer 104 is a likepolycarbonate material.

According to embodiments of the present invention, because the securitywafer 104 is embedded either fully or partially within the optical disk102, the security wafer's thickness should be less than the thickness ofthe optical disk. For example, CD and DVD disks share the same standardthickness, 1.2 mm. Thus, the thickness of a security wafer 104 must beless than 1.2 mm. In one embodiment, the security wafer is 0.127 mmthick. Other thicknesses may also be used. According to an alternativeembodiment (not shown), the security wafer 104 may be the same thicknessas the optical disk 102 and include a center hole, and this securitywafer is bonded to a specially formed optical disk, one formed toutilize such a security wafer as the hub area.

According to one embodiment of the present invention, the top surface ofthe security wafer 104 is flush with a surface of the optical disk 102.FIG. 2 is a pictorial diagram illustrating a cross-section of an opticaldisk 102 embedded with a security wafer 104, where the security wafer isembedded in the optical disk such that the top of the security wafer isflush with a surface of the optical disk.

FIG. 3 is a pictorial diagram illustrating one exemplary manner ofcreating the optical disk 102 embedded with a security wafer 104, asshown in FIG. 2, using a specially molded optical disk 302. Thespecially molded optical disk 302 includes a cavity 304 to accommodatethe security wafer 104, and is molded using a specially formed mold asdescribed in regard to FIG. 10. As will be described below in regard toFIG. 13, after a specially molded optical disk 302 is formed, thesecurity wafer 104 is placed in the cavity 304 and is bonded to thespecially molded optical disk 302.

While a security wafer 104 may be partially embedded in an optical disk102, such as described above in regard to FIG. 2, alternatively, thesecurity wafer may be entirely embedded within the optical disk. FIG. 4is a pictorial diagram illustrating an optical disk 102 having asecurity wafer 104 embedded entirely within the optical disk substrate.One advantage realized by entirely embedding the security wafer 104within the optical disk 102 is that removing the security wafer from theoptical disk completely destroys the hub area, rendering the opticaldisk unusable.

FIG. 5 is a pictorial diagram illustrating a cross-section of an opticaldisk 102 having a security wafer 104 embedded entirely within theoptical disk substrate, as described above in regard to FIG. 4. As shownin FIG. 5, the optical disk substrate is found on either side of thesecurity wafer. To create this embodiment, the security wafer 104 mustbe placed in the mold when the optical disk is created. This process isdescribed in greater detail below in regard to FIG. 12.

Often, when the security wafer 104 is placed in the mold prior toforming the optical disk 102, the security wafer will “float” to onesurface as the optical disk is formed, i.e., as the polycarbonatesubstrate is injected into the mold. In order to alleviate thissituation, and to generally realize the benefits of an entirely embeddedsecurity wafer, a spacing device may be added to the security wafer.

FIG. 6 is a pictorial diagram illustrating a security wafer 104 with aspacing device 602 on one side of the security wafer used to furtherembed the security wafer into the optical disk 102. Creating an opticaldisk 102 with a security wafer 104 having a spacing device 602 issubstantially the same as creating an optical disk having a fullyembedded security wafer, as described below in regard to FIG. 12.However, as the security wafer 104 tends to “float” to a surface duringcreation of the optical disk 102, the spacing device prevents thesecurity wafer from reaching the optical disk's surface, and allows theoptical disk's base material to almost entirely surround the securitywafer.

The combined thickness of the spacing device and the security wafer mustbe less than the thickness of the optical disk. Typically, the thicknessof the spacing device 602 is less than the thickness of the securitywafer 104. For example, in one embodiment, the security wafer 104 is0.127 mm thick, while the spacing device 602 is 0.100 mm thick. As shownin FIG. 6, the spacing device 602 may be a ring located on one surfaceof a security wafer 104. Other shapes may also be used, as well asmultiple spacing devices. For example, a plurality of small disks may beappropriately located on the surface of the security wafer 104. Whenusing a ring as the spacing device 602, as illustrated in FIG. 6, theinside diameter of the spacing device should correspond to the insidediameter of the hub area, i.e., 15.08 mm, as the optical disk's basematerial may not be able to flow into any cavity on the inside of thespacing device.

FIG. 7 is a pictorial diagram illustrating a cross-section of an opticaldisk 102 embedded with a security wafer 104 having a spacing device 602,and formed in the manner described in FIG. 4. As shown in FIG. 7, thespacing device 602 is flush with a surface of the optical disk 102.However, the security wafer 104 is almost entirely embedded within theoptical disk base material. Thus, any attempts to remove the securitywafer 104 from the optical disk will result in the destruction of thehub area, rendering the optical disk unusable.

FIG. 8 is a pictorial diagram illustrating another exemplary manner ofcreating an optical disk embedded with a security wafer using twospecially molded optical platters, platter 802 and platter 804, which,when combined with a security wafer 104, form a single optical disk 102.Similar to the specially molded optical disk 302 of FIG. 3, thespecially molded optical platters 802 and 804 are formed with a cavity,shown as cavity 806 and 808, to accept a security wafer 104. Thespecially molded optical platters 802 and 804 are bonded together withthe security wafer 104 located in the cavities 806 and 808.

FIG. 9A is a pictorial diagram illustrating a cross-section of anoptical disk 102 embedded with a security wafer 104 formed according tothe manner described above in regard to FIG. 8. As shown in thisdiagram, the security wafer 104 is generally located equally between thetwo specially molded optical platters 802 and 804 in the cavities 806and 808.

Alternatively (not shown), only one of the optical platters is speciallymolded with a cavity to accept a security wafer 104, while the otheroptical platter is a typical optical platter. FIG. 9B is a pictorialdiagram illustrating a cross-section of the resulting optical disk 102embedded with a security wafer 104 formed according to this alternativeembodiment. As shown, the security wafer 104 is positioned in the cavityof the specially molded optical platter 802 and flush with the second,typical optical platter 806 when they are bonded together.

As yet a further alternative (not shown), one or both of the opticalplatters may be molded such that the security wafer 104 is flush with anoutside surface of the resultant optical disk 102, i.e., after bondingthe optical platters. FIG. 9C is a pictorial diagram illustrating across-section of an optical disk 102 with a security wafer 104 partiallyembedded in a specially molded optical platter 802, and flush with asurface of the resulting optical disk 102.

Those skilled in the art will recognize that DVD disks are commonlyformed by bonding two optical platters together. Thus, the manner forcreating an optical disk 102 embedded with a security wafer 104described above in regard to FIGS. 8 and 9A–9C may be readily applied tocreating DVD disks. However, it should be understood that theabove-identified process should not be limited to creating DVD diskswith an embedded security wafer 104. For example, while CD disks aretypically created as a single platter, a CD disk embedded with asecurity wafer 104 may be created using two platters.

As already mentioned, various embodiments of the optical disk 102embedded with a security wafer 104 utilize a specially formed disk orplatter having a cavity to accommodate the security wafer. FIG. 10 is apictorial diagram illustrating a cross-section of an exemplary mold 1000for creating the specially molded optical disks or platters, asdescribed in regard to FIGS. 2 and 8. It should be understood, however,that, while FIG. 10 and the following discussion present some aspects ofmolds used for creating optical disks or platters, there are otheraspects that are not included in this discussion, but are well known inthe art.

As shown in FIG. 10, the mold 1000 is comprised of two halves, the topportion 1002, which has a center pin 1008, and the bottom portion 1004that is capable of receiving the center pin when the mold is closed.When the two halves of the mold 1000 are closed, a cavity area 1006 iscreated. This cavity area 1006 is filled with the optical disk's basematerial to form the disk or platter. In contrast to a typical mold, thetop portion 1002 shown in FIG. 10 includes a raised platform 1010 thatforms the cavity in the specially formed optical disk or platterdiscussed above.

The height of this raised platform 1010 corresponds to the height of thesecurity wafer 104, whether it is to be completely inserted into asingle cavity, or shared between two cavities, such as described abovein regard to FIGS. 8 and 9A. For example, a security wafer 104 isapproximately 0.127 mm thick. Thus, in one embodiment, the raisedplatform 1010 should be a corresponding height to accommodate thesecurity wafer when creating a specially formed optical disk 302 (FIG.3). Alternatively, if the mold 1000 is used to create specially formedoptical platters, such as platters 802 and 804 described in regard toFIG. 8, the height of the raised platform 1010 would be approximately0.064 mm.

FIG. 11A is a pictorial diagram illustrating a cross-section of anexemplary mold 1100 for creating optical disks, and having a securitywafer 104 placed on the center pin 1008 of the mold. The two halves ofthe mold 1100, the top portion 1102 and the bottom portion 1004, aretypical of those found in the prior art. In contrast to the mold 1000described above in regard to FIG. 10, the mold 1100, and in particularthe top portion 1102, does not have a raised platform. Instead, thisexemplary cross-section illustrates a security wafer 104 located on thecenter pin 1008. Placing the security wafer 104 on the center pin andsubsequently forming the optical disk 102 is consistent with the processdescribed above in regard to FIG. 5.

FIG. 11B is a pictorial diagram illustrating a cross-section of anexemplary mold 1100 for creating optical disks, and having a securitywafer 104 with a spacer device 602 placed on the center pin 1008 in themold. As shown in FIG. 12, by placing a spacing device 602 on thesecurity wafer 104, the security wafer is prevented from “floating” to asurface of the optical disk or platter, thereby embedding the securitywafer substantially within the base material.

FIG. 12 is a flow diagram illustrating an exemplary process 1200 forcreating an optical disk 102 embedded with a security wafer 104 using atypical optical disk mold, such as those illustrated in FIGS. 11A and11B. While certain aspects of the process for making optical disks aredescribed herein, they are included for describing the novel aspects ofcreating an optical disk 102 embedded with a security wafer 104. Thoseskilled in the art will recognize that other steps, and combinations ofsteps, are involved with creating, or molding, an optical disk.

Beginning at block 1202, a security wafer 104 is positioned onto thecenter pin 1008 of an open mold, such as mold 1100 of FIG. 11A. Thesecurity wafer 104 may or may not have a spacing device 602 attached toits surface. According to an actual embodiment, a robotic arm positionsthe security wafer 104 onto the center pin 1008 in the open mold 1100.However, any number of other mechanisms for positioning the securitywafer 104 onto the center pin 1008 may be utilized. After the securitywafer 104, with or without a spacing device 602, is positioned onto thecenter pin 1008, at block 1204, the mold 1100 is closed.

At block 1206, the closed mold 1100 is filled with the base material.Typically, this material is a liquefied polycarbonate substrate, andfilling the mold is performed by a well-known process referred to asinjection molding. At block 1208, the optical disk 102 is pressed,typically via a hydraulic ram. Those skilled in the art will recognizethat pressing the filled mold 1100 imprints data onto the optical mediafrom corresponding data located on the inner surface of one of the moldhalves.

At block 1210, the center hole of the formed optical disk is punched toremoved any sprues that may have formed, and to ensure that the centerhole is the proper dimension. At block 1212, the mold is opened and theoptical disk 102 embedded with a security wafer 104 may be removed.Thereafter, the routine 1200 terminates. As previously mentioned, othersteps may be taken to further prepare the optical disk 102 for deliveryto an end user, such as coating the data area with a reflectivesubstance, placing an exterior lacquer on the optical disk, printinglabeling onto the optical disk, and the like.

The routine 1200 described in FIG. 12 is directed at one embodiment forcreating an optical disk 102 embedded with a security wafer 104 byplacing the security wafer in the open mold 1100. Alternatively, FIG. 13is a flow diagram illustrating an alternative exemplary routine 1300 forcreating an optical disk 102 embedded with a security wafer 104 usingspecially formed optical disks or platters, such as those described inregard to FIG. 3.

Beginning at block 1302, a specially formed optical disk, such asoptical disk 302, having a cavity 304 to accept a security wafer 104 iscreated. Specially formed optical disks may be created using the mold1000 having a raised platform 1010, described above in regard to FIG.10. Other methods or molds may also be used, such as utilizing a specialstamp within the mold. At block 1304, the specially formed optical disk302 is obtained. At block 1306, a security wafer 104 is positioned intothe cavity 304 found on the optical disk 302. At block 1306, thesecurity wafer 104 is bonded to the optical disk 302. Thereafter theroutine 1300 terminates. As with the routine 1200 of FIG. 12, thoseskilled in the art will recognize that other steps that are notdescribed herein, and not directly related with embedding the securitywafer 104 in the optical disk 302, may also be taken.

FIG. 14 is a flow diagram illustrating yet another alternative routine1400 for creating an optical disk 102 embedded with a security wafer 104using specially formed optical platters, such as platters 802 and 804described in regard to FIG. 8. Beginning at block 1402, a firstspecially formed optical platter, such as platter 802 (FIG. 8), iscreated. As mentioned above, specially formed optical disks or plattersmay be created using a specially formed mold 1000 having a raisedplatform 1010, described above in regard to FIG. 10, or other methods,such as utilizing a special stamp within the mold. At block 1404, asecond specially formed optical platter, such as platter 804 (FIG. 8),is created.

At block 1406, a security wafer 104 is positioned between the first andsecond specially formed optical platters such that the security wafer islocated in the cavities of both the first and second optical platters.At block 1408, the first and second specially formed optical platters,and the security wafer, are bonded together. Bonding optical platterstogether is known in the art, and that same process may be used to bondthe first and second specially formed optical platters and the securitywafer 104. Thereafter, the exemplary routine 1400 terminates. Thoseskilled in the art will recognize that the optical platters and theresultant optical disk 102 embedded with a security wafer 104 willlikely undergo additional processing steps, typical of preparing anoptical disk for delivery to an end user, that are not described hereinbut are well known in the art.

While embodiments of the invention have been illustrated and described,including the preferred embodiment, it will be appreciated that variouschanges can be made therein without departing from the spirit and scopeof the invention.

1. A method for creating a counterfeit-resistant optical disk,comprising: positioning a security device in an optical disk mold,wherein the security device includes a spacing device attached to asurface of the security device such that the security device isprevented from being embedded flush with a surface of the formed opticaldisk; closing the optical disk mold; and forming an optical disk in theoptical disk mold, thereby embedding the security device in the formedoptical disk.
 2. The method of claim 1, wherein the security device is asecurity wafer.
 3. The method of claim 2, wherein positioning thesecurity device in the optical disk mold comprises positioning thesecurity device in the optical disk mold such that it is embeddedconcentrically in the formed optical disk.
 4. The method of claim 3,wherein positioning the security device in the optical disk moldcomprises positioning the security device on the center pin of theoptical disk mold.
 5. The method of claim 1, wherein the formed opticaldisk comprises an optical data storage area and a non-optical datastorage area, and wherein the security device is positioned in theoptical disk mold such that the security device is embedded in thenon-optical data storage area.
 6. The method of claim 1, wherein thesecurity device is comprised of the same base material as the formedoptical disk.
 7. The method of claim 6, wherein the spacing device iscomprised of the same base material as the formed optical disk.
 8. Themethod of claim 7, wherein the spacing device is a ring concentricallylocated on the security device.
 9. The method of claim 1, wherein thesecurity device includes a security feature that is used to identify theformed optical disk as a non-counterfeited optical disk.
 10. The methodof claim 9, wherein the security feature comprises a plurality ofmicroscopic taggants distributed on the security device.
 11. The methodof claim 9, wherein the security feature comprises a plurality ofmicroscopic taggants distributed in the base material of the securitydevice.
 12. The method of claim 9, wherein the security feature is aphoto-luminescent coating on the security device.
 13. The method ofclaim 9, wherein the security feature is a polarized filter.
 14. Themethod of claim 9, wherein the security feature is a radio frequencyidentification tag.
 15. The method of claim 9, wherein the securityfeature is a hologram on the security device.
 16. The method of claim 9,wherein the security feature is a serial number printed on the securitydevice.
 17. The method of claim 1, wherein the formed optical disk is aCD disk.
 18. The method of claim 1, wherein the formed optical disk is aDVD disk.